Highly Stable and Reliable Surface Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM5S

Strong Points of DO-218AB SM5S:

1. The chip inside is processed by globally leading technology of Chemical Etching Method, free from the negative effects caused by cutting stress. 2. DO-218AB has strong reverse surge capability, thanks to the chip's larger size than its competitors'. 3. Low leakage current from the edge of chip 4. TJ = 175 °C capability suitable for high reliability and automotive requirement 5. Low forward voltage drop 6. Meets ISO7637-2 surge specification (varied by test condition) 7. Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C

Steps of Chip Production

1. Mechanically Printing（Super-precise automatic wafer printing） 2. Automatic First-etching （Automatic Etching Equipment，CPK>1.67） 3. Automatic Polarity Test（Precise Polarity Test） 4. Automatic Assembly （Self-developed Automatic Precise Assembly） 5. Soldering (Protection with Mixture of Nitrogen & Hydrogen Vacuum Soldering ) 6. Automatic Second-etching (Automatic Second-etching with Ultra-pure Water) 7. Automatic Gluing (Uniform Gluing & Precise Calculation are Realized by Automatic Precise Gluing Equipment) 8. Automatic Thermal Test (Automatic Selection by Thermal Tester) 9. Automatic Test(Multifunctional Tester)